The Dieline Summit

The Dieline Summit

Launched jointly by the international EMBALLAGE exhibition (Comexposium) and THE DIELINE.COM, the first edition of “The Dieline Summit” was held at the Palais des Congrès in Paris on the 16th and 17th November.

Emballage 3

A first in Europe, this conference brought together the world of professional designers and packaging enthusiasts. Its mission: to reinvent package design in the presence of stakeholders, leaders in their sector.

In total, 150 delegates including 75% international visitors gathered to witness this great event around Andrew Gibbs (creator of The in the USA) and Fabrice Peltier (President of the INDP) to address a simple question: “What is the future of Package Design?”

Emballage 2

No fewer than 26 nationalities* were represented among the delegates. Japan, Russia, Taiwan… participants came from far and wide to listen, learn and better understand the future of packaging design, thanks to a well-qualified and influential group of speakers.

It was the guest of honour, REBECCA COSTA, the American sociobiologist, author and radio host, who opened the conference at the La Vue Bar at the Hyatt Regency hotel on Sunday evening, highlighting the advances that will contribute to the evolution of packaging: 3D printing, facial recognition, holograms, delivery drones, biodegradable packaging, miniaturisation, etc.

Emballage 1

Then on Monday, November 17th from 9am to 5.30pm, workshops and roundtables enabled package design professionals to better understand the role of design in their brand strategy and the vital role of package design today and tomorrow.

Stephanie Cornwall
Stephanie Cornwall